We design, manufacture, market and globally support semiconductor wafer processing equipment used in the fabrication of integrated circuits.

Our manufacturing equipment for Dry Strip, Plasma Etch, Surface Treatment and Ultra-Selective Materials Removal, Rapid Thermal Processing and Millisecond Anneal utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation integrated circuits.

Headquartered in Silicon Valley, we maintain a global infrastructure to meet the needs of our diverse customer base.